Examination of the Future of the Conventional Transistor

EE 311 · Stanford University

Set of Slides on the Topic of Shallow Junctions

EE 311 · Stanford University

Examination of the Principles of High-Performance Interconnects

EE 311 · Stanford University

Final Project for an Advanced Integrated Circuits Technology Course

EE 311 · Stanford University

Lecture Notes for an Advanced Integrated Circuits Technology Course

EE 311 · Stanford University

Examination of the Use of Thin Dielectrics for MOS Gates

EE 311 · Stanford University

Examination of the Transistor Elements for 30nm Physical Gate Length and Beyond

EE 311 · Stanford University

Introduction to the Principles of Metal-Semiconductor Junctions

EE 311 · Stanford University

Overview of the Trends in Integrated Circuits Technology

EE 311 · Stanford University

Examination of the Process Integration Issues of Low-Permittivity Dielectrics with Copper for High-Performance Interconnects

EE 311 · Stanford University

Introduction to the Use of Low-k Dielectrics in Integrated Circuits

EE 311 · Stanford University

Introduction to the Principles of Interconnections in Integrated Circuits

EE 311 · Stanford University

Introduction to the TSUPREM Software Program

EE 311 · Stanford University

Second Look at the Trends in Integrated Circuits Technology

EE 311 · Stanford University

Study Notes for an Advanced Integrated Circuits Technology Course

EE 311 · Stanford University

Second Look at the Process Integration Issues of Low-Permittivity Dielectrics with Copper

EE 311 · Stanford University

Second Look at the Use of Low-k Dielectrics in Integrated Circuits

EE 311 · Stanford University

advanced integrated circuits technology 5643

EE 311 — Advanced Integrated Circuits Technology

Examination of the Future of the Conventional Transistor

Set of Slides on the Topic of Shallow Junctions

Examination of the Principles of High-Performance Interconnects

Final Project for an Advanced Integrated Circuits Technology Course

Lecture Notes for an Advanced Integrated Circuits Technology Course

Examination of the Use of Thin Dielectrics for MOS Gates

Examination of the Transistor Elements for 30nm Physical Gate Length and Beyond

Introduction to the Principles of Metal-Semiconductor Junctions

Overview of the Trends in Integrated Circuits Technology

Examination of the Process Integration Issues of Low-Permittivity Dielectrics with Copper for High-Performance Interconnects

Introduction to the Use of Low-k Dielectrics in Integrated Circuits

Introduction to the Principles of Interconnections in Integrated Circuits

Introduction to the TSUPREM Software Program

Second Look at the Trends in Integrated Circuits Technology

Study Notes for an Advanced Integrated Circuits Technology Course

Second Look at the Process Integration Issues of Low-Permittivity Dielectrics with Copper

Second Look at the Use of Low-k Dielectrics in Integrated Circuits

EE 311 — Advanced Integrated Circuits Technology

Examination of the Future of the Conventional Transistor

Set of Slides on the Topic of Shallow Junctions

Examination of the Principles of High-Performance Interconnects

Final Project for an Advanced Integrated Circuits Technology Course

Lecture Notes for an Advanced Integrated Circuits Technology Course

Examination of the Use of Thin Dielectrics for MOS Gates

Examination of the Transistor Elements for 30nm Physical Gate Length and Beyond

Introduction to the Principles of Metal-Semiconductor Junctions

Overview of the Trends in Integrated Circuits Technology

Examination of the Process Integration Issues of Low-Permittivity Dielectrics with Copper for High-Performance Interconnects

Introduction to the Use of Low-k Dielectrics in Integrated Circuits

Introduction to the Principles of Interconnections in Integrated Circuits

Introduction to the TSUPREM Software Program

Second Look at the Trends in Integrated Circuits Technology

Study Notes for an Advanced Integrated Circuits Technology Course

Second Look at the Process Integration Issues of Low-Permittivity Dielectrics with Copper

Second Look at the Use of Low-k Dielectrics in Integrated Circuits