What This Document Is
This is a lecture session from ELENG 130: Integrated-Circuit Devices at UC Berkeley, covering the fundamental technologies and processes behind modern integrated circuits. It delves into the core principles of how microchips are created, moving beyond theoretical circuit analysis to explore the physical fabrication methods. The material is presented in a lecture format, likely accompanied by visual aids, and provides a detailed overview of the steps involved in building complex semiconductor devices.
Why This Document Matters
This resource is invaluable for electrical engineering and computer engineering students seeking a deeper understanding of the practical realization of electronic components. It’s particularly helpful for those studying semiconductor physics, microfabrication, or VLSI design. It’s best utilized during coursework focused on device fabrication, or as a reference when needing to understand the limitations and possibilities of integrated circuit technology. Professionals in related fields may also find it useful for refreshing their knowledge of foundational concepts.
Topics Covered
* IC Technology Overview & Fabrication Principles
* Planar Fabrication Processes and Wafer Processing
* Insulating Film Formation Techniques
* Patterning Methods – Lithography and Etching
* Dopant Introduction Techniques – Ion Implantation
* MOSFET Fabrication Steps
* CMOS Technology Fundamentals
What This Document Provides
* A comprehensive outline of the IC fabrication workflow.
* Discussion of key materials used in CMOS integrated circuits.
* Examination of equipment utilized in semiconductor manufacturing.
* Visual representations supporting the explanation of complex processes.
* An exploration of the relationship between process steps and device characteristics.
