What This Document Is
This document represents lecture notes from EE 143: Microfabrication Technology at the University of California, Berkeley, specifically focusing on interconnects and contacts within CMOS technology. It delves into the complexities of creating reliable and efficient connections within microfabricated devices, a critical aspect of modern electronics. This material is designed to supplement in-class lectures and provide a deeper understanding of the challenges and solutions related to interconnect design and fabrication.
Why This Document Matters
This resource is invaluable for students enrolled in advanced microfabrication courses, particularly those specializing in VLSI design, semiconductor physics, or materials science. It’s most beneficial when studying the practical implementation of integrated circuits and the factors influencing device performance at the microscopic level. Professionals working in semiconductor manufacturing or research and development will also find this a useful reference for understanding the intricacies of interconnect technology. Accessing the full content will provide a comprehensive understanding needed to tackle complex microfabrication challenges.
Topics Covered
* Metal-to-Silicon Contact Formation and Optimization
* Techniques for Minimizing Contact Resistance
* Issues related to Aluminum Metallization, including diffusion and electromigration
* Advanced Contact Structures: Buried Contacts and Silicidation Processes
* Methods for Measuring and Analyzing Contact Resistance
* Strategies for improving interconnect reliability and performance
* Polysilicon-to-Metal Contact challenges and solutions
What This Document Provides
* Detailed exploration of sintering processes and their impact on device characteristics.
* Discussion of methods to mitigate issues arising from material interactions during high-temperature processing.
* Examination of various techniques used to characterize and improve contact resistance.
* Insights into the principles behind electromigration and strategies for enhancing interconnect durability.
* Overview of advanced contact schemes designed to optimize space and performance in integrated circuits.
* A foundation for understanding the trade-offs involved in selecting materials and processes for interconnect fabrication.
