What This Document Is
This is a problem set assignment for EE 143, Microfabrication Technology, at the University of California, Berkeley. It’s designed to reinforce understanding of core concepts related to integrated circuit (IC) fabrication, specifically focusing on the critical area of process integration – how individual fabrication steps combine to create functional devices. This assignment challenges students to apply theoretical knowledge to practical scenarios encountered in microfabrication.
Why This Document Matters
This assignment is essential for students enrolled in a microfabrication course, or those preparing for related roles in semiconductor manufacturing, materials science, or electrical engineering. It’s particularly valuable when you’re working to solidify your understanding of how process flows are designed and analyzed. Successfully completing this assignment demonstrates a strong grasp of the sequential nature of microfabrication and the impact of each step on the final device structure. It’s best utilized *after* initial lectures and readings on process flow design and lithography.
Topics Covered
* Process Flow Analysis
* Lithography Techniques (positive/negative photoresist selection)
* Ion Implantation
* Thin Film Deposition (Sputtering & Evaporation)
* Etching Processes
* Lift-off Techniques
* Mask Design Considerations
* Cross-Sectional Analysis of Fabricated Structures
What This Document Provides
* A series of targeted problems designed to test your understanding of process integration.
* A specific fabrication scenario (pn diode) to analyze and manipulate.
* Opportunities to compare and contrast different fabrication methods (etching vs. lift-off).
* References to external learning resources (textbook problems).
* A framework for visualizing the impact of process steps on device geometry.
