What This Document Is
This document represents a focused set of lecture notes from Introduction to MEMS Design (ELENG C245) at UC Berkeley, specifically covering critical microfabrication processes. It delves into the techniques used to sculpt and modify materials at the microscopic level, essential for creating Micro-Electro-Mechanical Systems. This material represents Lecture 7 of the course, providing a concentrated overview of key process modules.
Why This Document Matters
This resource is invaluable for students enrolled in MEMS design courses, or those with a background in electrical engineering and materials science seeking to understand the foundational processes behind MEMS fabrication. It’s particularly helpful when studying for exams, reviewing lecture material, or preparing for more advanced topics in microfabrication. Access to this content will strengthen your understanding of the practical methods used to bring MEMS designs to life.
Topics Covered
* Dry Etching Techniques (Physical Sputtering, Plasma Etching, Reactive Ion Etching)
* The principles of Ion Implantation and its role in MEMS fabrication
* Diffusion processes and their application in material modification
* Selectivity challenges in etching processes
* Mechanisms behind plasma generation and its impact on etching
* The role of reactive species in chemical reactions during etching
* Surface interactions and their influence on etching anisotropy
What This Document Provides
* A detailed outline of the lecture’s core concepts.
* An exploration of the underlying principles governing various etching methods.
* Discussion of the advantages and disadvantages of different fabrication techniques.
* Insights into the factors influencing etch rate and selectivity.
* A foundational understanding of the physics and chemistry behind microfabrication processes.
* A focused resource to supplement textbook readings and classroom lectures.
