What This Document Is
This document is a comprehensive lecture outline focusing on the fundamental processes involved in the fabrication of Micro-Electro-Mechanical Systems (MEMS). It’s designed to provide a detailed overview of the techniques and materials used to create these miniature devices, bridging the gap between integrated circuit processing and specialized MEMS manufacturing methods. The material originates from an upper-level undergraduate course at the University of California, Berkeley.
Why This Document Matters
This resource is invaluable for students and engineers seeking a strong foundation in MEMS design and manufacturing. It’s particularly useful for those enrolled in introductory MEMS courses, or anyone needing a refresher on the core principles. It serves as an excellent companion to textbook readings and provides context for understanding the practical challenges and considerations in MEMS fabrication. Understanding these concepts is crucial for anyone involved in the design, analysis, or production of MEMS devices.
Topics Covered
* Core tools and techniques essential for MEMS fabrication.
* A review of photolithography principles and their application to MEMS.
* The crystal structure of silicon and its impact on fabrication processes.
* Various silicon etching techniques and their characteristics.
* Comparison of standard IC processing with unique MEMS processing steps.
* Material selection for MEMS substrates and thin films.
* Considerations for packaging and testing of MEMS devices.
* Silicon crystallography and wafer orientation.
* Mechanical properties of silicon relevant to MEMS design.
What This Document Provides
* A structured lecture outline for focused learning.
* References to key academic readings in the field.
* Visual aids illustrating MEMS device examples and processing steps.
* An overview of the interplay between electrical and mechanical considerations in MEMS.
* A foundational understanding of the materials science behind MEMS fabrication.
* Insights into the challenges of 3-D assembly and wafer bonding in MEMS manufacturing.
