What This Document Is
This document contains the textual content from a lecture delivered as part of an Introduction to MEMS Design course (ELENG C245) at the University of California, Berkeley. It focuses on the foundational principles and practical techniques within the field of Micro-Electro-Mechanical Systems (MEMS) design, specifically delving into surface micromachining processes. This material represents a core component of understanding how to fabricate and implement MEMS devices.
Why This Document Matters
This lecture text is invaluable for students enrolled in MEMS design courses, or those seeking a detailed understanding of the fabrication processes involved in creating microscopic devices. It’s particularly useful for reinforcing concepts presented in class, preparing for assignments, and building a strong foundation for more advanced topics. Engineers and researchers interested in the practical aspects of MEMS manufacturing will also find this a helpful resource. Access to the full content will allow for a deeper understanding of the nuances of MEMS design.
Topics Covered
* Polysilicon surface micromachining techniques
* Considerations for stiction and residual stress in MEMS structures
* Topographical challenges in micromachining
* Nickel metal surface micromachining methods
* Fabrication of three-dimensional “pop-up” MEMS devices
* Overview of industry-standard MEMS fabrication processes (MUMPS & SUMMIT)
* Material properties relevant to MEMS design, such as Young’s Modulus and fracture strength.
* Layout and masking layers for MEMS fabrication.
What This Document Provides
* A detailed lecture outline for focused study.
* In-depth exploration of polysilicon as a key material in MEMS fabrication.
* A step-by-step overview of surface micromachining process flows.
* Discussion of critical process parameters and their impact on device performance.
* Insights into the use of various masking layers in MEMS fabrication.
* References to relevant chapters in established MEMS textbooks.
