What This Document Is
This is a focused review resource designed to help students prepare for the midterm examination in ELENG 143: Microfabrication Technology at the University of California, Berkeley. It consolidates key concepts and principles covered in the course, offering a structured approach to revisiting core material before assessment. The review is presented in a format suitable for efficient study and self-assessment.
Why This Document Matters
This review is invaluable for students aiming to solidify their understanding of microfabrication processes and principles. It’s particularly useful in the days leading up to the midterm, serving as a concentrated refresher. Students who utilize this resource will be better equipped to identify areas needing further attention and approach the exam with increased confidence. It’s designed to complement, not replace, thorough engagement with course lectures and assigned readings.
Topics Covered
* Optical Lithography: Including depth of focus and image formation.
* Photoresist Properties: Examining behavior under exposure and development.
* Thin Film Deposition: Covering techniques like CVD and related modeling.
* Etching Processes: Exploring anisotropic and isotropic etching, selectivity, and control mechanisms.
* Thermal Oxidation: Understanding the underlying model and influencing factors.
* Overlay Error Analysis: Investigating sources and implications in multi-layer fabrication.
* Plasma Etching: Examining the impact of process variables on etching characteristics.
* Lift-off Techniques: Principles and performance considerations.
What This Document Provides
* Visual representations of key concepts, aiding in comprehension.
* Summaries of important relationships and equations relevant to microfabrication.
* Illustrative examples designed to highlight critical considerations in process control.
* A focused review of material directly applicable to the ELENG 143 midterm.
* Conceptual frameworks for understanding complex fabrication processes.
* Discussion of factors influencing etching selectivity and anisotropy.
