What This Document Is
These are session notes from Introduction to MEMS Design (ELENG C245) at UC Berkeley, specifically covering Lecture 12 on the Mechanics of Materials crucial to Micro-Electro-Mechanical Systems. This resource delves into the various techniques used to join different materials in MEMS fabrication, a fundamental aspect of creating functional devices. It’s a detailed record of the lecture, intended to supplement textbook learning and provide a deeper understanding of the concepts presented in class.
Why This Document Matters
This session note is invaluable for students enrolled in a MEMS design course, or those with a strong interest in the fabrication processes behind these miniature systems. It’s particularly helpful when reviewing material after a lecture, preparing for assignments, or seeking a consolidated reference for bonding methodologies. Understanding these techniques is essential for anyone designing, fabricating, or analyzing MEMS devices, as material integration significantly impacts device performance and reliability.
Topics Covered
* Different wafer bonding methods used in MEMS fabrication.
* The principles behind anodic bonding and its advantages.
* Various metal layer bonding techniques, including eutectic and solder bonding.
* Thermocompression bonding and its applications.
* An overview of Silicon-on-Insulator (SOI) MEMS technology.
* Advanced fabrication techniques like the SCREAM process.
* The use of Hexsil MEMS in achieving high aspect ratio structures.
What This Document Provides
* A comprehensive overview of different material joining techniques.
* Discussion of the process parameters and considerations for each bonding method.
* Insight into the compatibility of different materials in MEMS fabrication.
* A foundational understanding of the mechanical aspects of materials used in MEMS.
* Contextual information relating to specific MEMS applications and fabrication workflows.
